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IEEE EMBS Conference on Biomedical Engineering and Sciences (IECBES2020)
1st - 3rd March 2021
LANGKAWI, MALAYSIA

IEEE Engineering in Medicine & Biology Society (Malaysia Chapter) is pleased to announce the 6th installation of our flagship conference, IEEE-EMBS Conference on Biomedical Engineering and Sciences (IECBES 2020). Contact us at info@iecbes.org for more details.


Welcome


IECBES2020 is now an online conference.


The IEEE Engineering in Medicine and Biology Society (IEEE-EMBS) Malaysia Chapter is pleased to announce the 6th IEEE-EMBS Conference on Biomedical Engineering and Sciences (IECBES 2020). Year 2021 marks the Malaysia chapter’s 10th year of commitment to recognizing and featuring research frontiers in biomedical engineering and sciences in its flagship conference. It is with this pride and honor that we invite you to attend IECBES 2020 which will be held in the island of Langkawi, Malaysia from December 1st to 3rd March, 2021.

As the premier biomedical engineering and sciences conference in this region, we have carefully established strategic partnerships with key authorities and figures in the field to share cutting-edge research and innovation to facilitate and push boundaries in biomedical engineering and sciences research. The conference has come a long way since its humble inception in 2010.



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Leading Modern Healthcare Technology: Enhancing Wellness



In this commemorative year - we are celebrating the success and achievements of all our delegates, past and present. This year’s conference theme: Leading Modern Healthcare Technology: Enhancing Wellness will cover diverse topics in biomedical engineering, healthcare technology and medical informatics in improving the wellbeing of the world’s community. All factors that influence health, wellness, and disease are taken into consideration, including mind, spirit, and community, as well as the body. The conference program will feature high-profile keynote lectures, exhibitions, mini-symposia, workshops, invited sessions, oral and poster sessions, and special sessions for students, young professions, clinicians and entrepreneurs.

IECBES 2020 welcomes original submissions that have not been published by researchers, clinicians, and industrial partners from the biomedical, life sciences, medical, and industrial communities. All papers will be peer-reviewed. Accepted full-length 4-6 page papers will be submitted for publication in IEEE Xplore. The past proceedings of IECBES2010, IECBES2012, IECBES2014, IECBES2016 and IECBES2018 have been published by IEEE in IEEE Xplore and indexed by ISI Proceedings (Thomson Reuters), Scopus, Scimago and Google scholar.

In this year's edition, we will be inviting short-listed papers/authors to submit revised and extended version of their papers, for an additional publication in a Scopus indexed journal.





Important Dates



+4 days
08 Dec 2020
early bird
+27 days
31 Dec 2020
camera ready
+87 days
01 Mar 2021
conference






Our Sponsors



Supported by:



   



Our Tracks

IECBES 2020 invites knowledge sharing on a spectrum of topics within the EMB bandwidth, relevant but not limited to the following tracks:




Biomedical Signal Processing
Biomedical Instrumentation and Devices
Biosensors / Micro / Nano and Wearable Technologies
Biomedical Imaging and Image Processing
Cardiovascular and Respiratory Systems
Neural Engineering & Brain Computer Interface
Biomedical Modelling and Simulation
Biomedical and Medical Robots
Smart Implant
Pharmaceutical Engineering and Drug Delivery Systems
Biomedical and Health Informatics
Internet of Things in Healthcare
Diagnostic, Therapeutic and Rehabilitation Engineering
Sports Engineering and Technology
Biomedical Engineering Education and Society

Our People



Keynotes



Toshiyo Tamura

Waseda Uni., Japan

Fabrice Meriaudeau

Uni. Of Burgundy, France

Edward Sazonov

Uni of Alabama, USA

Ricardo Armentano

Uni de la República, Uruguay

Eric Woo

ECRI Malaysia

Fatimah Ibrahim

Uni of Malaya





Organizing Committees



Siti Anom Ahmad

UNIVERSITI PUTRA MALAYSIA

Chair

sanom@upm.edu.my

Norliza Mohd. Noor

UNIVERSITI TEKNOLOGI MALAYSIA

Vice Chair

norliza@utm.my

Wahidah Mansor

UNIVERSITI TEKNOLOGI MARA

Vice Chair

wahidah231@salam.uitm.edu.my

Ezreen Farina Shair

Universiti Teknikal Malaysia Melaka

Secretary

ezreen@utem.edu.my

Alpha Agape Gopalai

MONASH UNIVERSITY MALAYSIA

Local Arrangement

alpha.agape@monash.edu

Chong Yu Zheng

UNIVERSITI TUNKU ABDUL RAHMAN

Treasurer

yzchong@ieee.org

Darwin Gouwanda

MONASH UNIVERSITY MALAYSIA

Technical Program

darwin.gouwanda@monash.edu

Nabilah Ibrahim

Universiti Tun Hussein Onn Malaysia

Technical Program

Lee Yoot Khuan

UNIVERSITI TEKNOLOGI MARA

Publication Chair

leeyootkhuan@salam.uitm.edu.my

Afaf Rozan

UNIVERSITI TEKNOLOGI MARA

Publication Co-chair

nikrozan@yahoo.com

Yogeswaran Mohan

JKS ENGINEERING (M) SDN. BHD.

Publicity & Website

yog@jkseng.com

Zulkifli Mahmoodin

Universiti Kuala Lumpur

Secretariat



Fees Structure



CATEGORIES VIRTUAL
MYR USD
Early Bird Normal Early Bird Normal
IEEE-EMBS Student Member 400 550 105 145
IEEE Student Member 550 700 145 185
Student Non-Member 650 800 170 210
IEEE-EMBS Member 800 950 210 250
IEEE Member 900 1050 235 275
Non-IEEE Member 1000 1150 265 305


MYR USD
Day Pass 50 15
3-Day Pass 100 25


For ALL registration, each registration will only be entitled to one paper submission with one paper presentation.
For TT, and Interbank Transfer, kindly provide proof of transfer to https://forms.gle/y3TUcsmwRT2JaqaK8.

Our bank information:
  • Bank - Bank Islam Berhad
  • Bank Account Name - EMBS Conference
  • Bank Account Number - 1417 1010 0059 41
  • SWIFT Code - BIMBMYKL [For international TT]
For IEEE-EMBS Members, IEEE Members, and Students, kindly submit respective documentation at https://forms.gle/y3TUcsmwRT2JaqaK8.

The registration fee includes:
  • Conference kit
  • Admission to all technical program sessions


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